| Oven |
| Oven Dimensions | 28 × 31 × 16 cm |
| Column Capacity | Up to two 105 m × 0.530 mm ID capillary columns, or two 10-ft glass packed columns (9 in coil diameter, 1/4 in OD), or two 20-ft stainless steel packed columns (1/8 in OD) |
| Operating Temperature Range | Ambient +4°C to 400°C |
| With LN₂ Cryogenic Cooling | -80°C to 450°C |
| With CO₂ Cryogenic Cooling | -40°C to 450°C |
| Temperature Setpoint Resolution | 0.1°C |
| Temperature Programming |
| Temperature Ramps | Supports up to 30 oven ramps with 31 plateaus |
| Ramp Functionality | Negative ramps supported for advanced control |
| Oven Cooldown | 450°C to 50°C in 4.0 minutes (at 22°C ambient) |
| Maximum Ramp Rate | 120°C/min |
| Maximum Run Time | 999.99 min (16.7 h) |
| Valve Support |
| Valves Supported | Up to 8 valves |
| Independent Heated Zones |
| Zones (Excluding Oven) | 12 (two inlets, five detectors, and five auxiliary) |
| Electronic Pneumatics Control (EPC) |
| Atmospheric Compensation | Built-in sensor for altitude and ambient temperature variation |
| Pressure Adjustment | Increments of 0.001 psi |
| Pressure/Flow Ramps | Up to 3 |
| Gas Types Supported | He, H₂, N₂, Argon/Methane |
| Setpoints | Flow or pressure setpoints configurable via 7" touchscreen or UniStation software |
| Automated Carrier Flow | Maintains constant flow when capillary column dimensions are entered |
| Flow Sensors (S/SL Inlets) | Enables control of split ratio |
| Inlet Pressure Sensors | Accuracy: <±2% full scale; Repeatability: <±0.05 psi; Temp. Coefficient: <±0.01 psi/°C; Drift: <±0.1 psi/6 months |
| Flow Sensors | Accuracy: <±5%; Repeatability: <±0.35% of setpoint |
| Flow Temp. Coefficient | <±0.20 mL/min/°C (He, H₂); <±0.05 mL/min/°C (N₂, Ar/CH₄) |
| Detector Modules | Accuracy: <±3 mL/min NTP or 7% of setpoint; Repeatability: <±0.35% of setpoint; Temp. Coefficient: <±0.20 mL/min/°C NTP |
| Inlets Overview |
| Maximum Inlets | 2 |
| Available Inlet Types | PPIP, S/SL, COC (PCOC), PTV (3rd party), VI |
| S/SL (Split/Splitless Capillary Inlet) |
| Column Compatibility | All capillary columns |
| Split Ratio | Up to 7500:1 |
| Splitless Mode | Pressure-pulsed mode for trace analysis |
| Maximum Temperature | 400°C |
| EPC Pressure Range | 0–100 psig for ≥0.20 mm columns; 0–150 psig for <0.20 mm columns |
| Pressure Resolution | 0.01 psig |
| Total Flow Control | Up to 1000 mL/min (He, H₂) |
| Gas Saver Mode | Reduces gas use without performance loss |
| Septum Purge | Independent pressure-controlled purge eliminates ghost peaks |
| Total Flow Range | 0–200 mL/min (N₂), 0–1000 mL/min (He, H₂) |
| PPIP (Packed Purged Injection Port) |
| Compatibility | Direct injection on packed and wide-bore capillary columns |
| Flow/Pressure Control | Pressure: 0–100 psig; Flow: 0.0–200.0 mL/min |
| Septum Purge | Electronic control |
| Maximum Temperature | 400°C |
| Adapters | For 1/4 in, 1/8 in packed columns, and 0.530 mm capillary columns |
| COC (Cool-On-Column Inlet) |
| Injection Type | Direct injection onto cool capillary column ensures quantitative transfer with no thermal degradation |
| Liquid Injection | Automatic injection for columns ≥0.250 mm ID |
| Maximum Temperature | 450°C |
| Temperature Programming | 3 ramps or tracking oven; optional -40°C subambient control |
| EPC Range | 0–100 psig |
| Septum Purge | Electronic flow control |
| Optional Features | Solvent vapor exit for large-volume injections; electronically controlled inert three-way valve; preassembled retention gap/vent line/column set |
| VI (Volatiles Inlet) |
| Internal Volume | 32 µL |
| Sample Types | Gas or pre-vaporized samples |
| Recommended For | Headspace, purge & trap, or thermal desorption |
| Modes | Split (up to 100:1), Splitless, Direct |
| EPC Control | He or H₂ carrier; 0–100 psig pressure; 0.0–100 mL/min flow |
| Septum Purge | Electronic control |
| Flow Path | Treated inert surface to minimize adsorption |
| Maximum Temperature | 400°C |
| FID (Flame Ionization Detector) |
| Minimum Detectable Level | <2.1 pgC/s (tridecane) |
| Linear Dynamic Range | >10⁷ (±10%) |
| Data Rate | Up to 200 Hz |
| EPC Control | Air: 0–800 mL/min; H₂: 0–100 mL/min; Makeup (N₂ or He): 0–100 mL/min |
| Versions | Capillary-optimized or universal (capillary/packed) |
| Features | Flameout detection and auto-reignition, grounded jet |
| Maximum Temperature | 450°C |
| TCD (Thermal Conductivity Detector) |
| Minimum Detectable Level | 500 pg propane/mL (He carrier) |
| Linear Dynamic Range | >10⁵ (±5%) |
| Stabilization | Rapid via fluidic switching design |
| Signal Polarity | Programmable |
| Maximum Temperature | 400°C |
| EPC Gases | He, H₂, Ar, or N₂ (matched to carrier) |
| Makeup Gas | 0–12 mL/min |
| Reference Gas | 0–100 mL/min |
| FPD/DFPD (Flame Photometric Detector) |
| Versions | Single- or Dual-Wavelength |
| Sensitivity | <67.5 fg P/s; <3.75 pg S/s (methyl parathion) |
| Dynamic Range | >10³ (S), 10⁴ (P) |
| Selectivity | 10⁶ g S/g C; 10⁶ g P/g C |
| Data Rate | Up to 200 Hz |
| EPC Control | Air: 0–200 mL/min; H₂: 0–250 mL/min; Makeup: 0–130 mL/min |
| Maximum Temperature | 400°C |
| Micro-ECD (Electron Capture Detector) |
| Minimum Detectable Level | <12 fg/mL lindane |
| Linear Dynamic Range | >5 × 10⁴ (lindane) |
| Data Rate | Up to 50 Hz |
| Source | ⁶³Ni, <3.7×10⁸ Bq |
| Design | Micro-cell minimizes contamination, enhances sensitivity |
| Maximum Temperature | 400°C |
| EPC Makeup Gas | Ar/5% CH₄ or N₂; 0–150 mL/min |
| Dynamic Range | >5 × 10⁵ (lindane) |
| Auxiliary EPC |
| Location | One EPC position on back of GC; external box supports 3 detectors (FID, TCD, ECD) and 2 Aux EPC modules |
| Channels | 3 pressure control channels |
| Compensation | Atmospheric pressure and temperature |
| Regulation | Forward pressure regulated |
| Max Modules per GC | 4 auxiliary EPC modules |
| PCM (Pneumatics Control Module) |
| Channels | 1 main EPC channel, 1 secondary pressure control channel |
| Control Type | Pressure or flow (Psig and Psia); forward or back pressure regulation |
| Max Modules per GC | 3 PCMs |
| Capillary Flow Technology |
| Design | Leak-free, in-oven capillary connections for complex analyses |
| Construction | Photolithographic chemical milling and diffusion bonding |
| Form Factor | “Credit card” profile for fast thermal response |
| Surface Treatment | Fully deactivated internal surfaces for inertness |
| Devices Supported | Deans switch, purged splitters, ultimate unions (each requires one EPC or PCM channel) |
